| 摘要 |
An unpacked structure for a power device of radio frequency power amplification module and assembly method therefor. The radio frequency power amplification module comprises the power device, a heat radiation plate and a printed circuit board, wherein the power device is embedded into the printed circuit board; the heat radiation plate is arranged below the power device and the printed circuit board; the power device comprises a carrier flange, a plurality of electronic elements and a plurality of lead wires; the electronic elements are directly welded on the carrier flange according to a design requirement; the power device and the printed circuit board are welded and fixed on the heat radiation plate; and the electronic elements on the power device are connected with one another through the lead wires and directly connected with the printed circuit board through the lead wires. According to the present invention, the problem caused during device packing is solved, and a user can use the device flexibly; the cost is saved, the degree of freedom of the design and the performance are improved, and a customization design demand can be met. |
