| 摘要 |
Read wiring traces and write wiring traces are formed on an insulating layer that is formed on a support substrate. Connection terminals that are electrically connectable to external circuits are formed at parts of the read wiring traces and write wiring traces on the insulating layer, respectively. Openings are formed in the support substrate so as to partially or entirely surround overlap regions that overlap with the connection terminals and have the same plane shape as the connection terminals. Parts of the insulating layer are exposed in the openings. |
