| 摘要 |
A SEMICONDUCTOR DIE PACKAGE (100) IS DISCLOSED. IN ONE EMBODIMENT, THE SEMICONDUCTOR DIE PACKAGE (100) HAS A SUBSTRATE (40). IT INCLUDES (I) A LEAD FRAME STRUCTURE (10) INCLUDING A DIE ATTACH REGION (12) WITH A DIE ATTACH SURFACE AND A LEAD HAVING A LEAD SURFACE, AND (II) A MOLDING MATERIAL (20). THE DIE ATTACH SURFACE AND THE LEAD SURFACE ARE EXPOSED THROUGH THE MOLDING MATERIAL (20). A SEMICONDUCTOR DIE (50) IS ON THE DIE ATTACH REGION (12), AND THE SEMICONDUCTOR DIE (50) IS ELECTRICALLY COUPLED TO THE LEAD. |
