SHEET CUTTING DEVICE, CHIP MANUFACTURING DEVICE, SHEET CUTTING METHOD, CHIP MANUFACTURING METHOD AND SHEET CUTTING PROGRAM

摘要

PROBLEM TO BE SOLVED: To provide a sheet cutting device capable of suppressing a damaged wafer.SOLUTION: A sheet cutting device 1 cuts off a sheet 5 stuck on a member to be stuck (a semiconductor wafer 6, for example) along the peripheral edge of the member to be stuck by laser light L. Preferably, the sheet 5 is cut off in the vicinity of the edge portion of a sticking portion of the sheet 5 with the member to be stuck. Further, preferably, the member to be stuck is a semiconductor wafer 6 and the sheet 5 is cut off by laser light having a character not producing a thermal effect upon the semiconductor wafer 6.