HEATING SYSTEM AND METHOD OF TESTING A SEMICONDUCTOR DEVICE USING A HEATING SYSTEM

摘要

A heating system (300) is described for generating heat and bringing heat to a semiconductor device under test (100). The heating system comprises a conduction heating unit (250) comprising a heating resistor (240), a thermal contact area (222) for thermally contacting the semiconductor device under test (100), and a thermally conductive and electrically insulating connection (220, 242) between the heating resistor (240) and the thermal contact area (222). The heating resistor (240) is operable to generate a user-defined amount of heat and arranged to provide a part of the heat generated by the heating resistor (240) to the thermal contact area (222) via the thermally conductive and electrically insulating connection (220, 242). It is also described that the heating system (300) may further comprise a convection heating chamber (310) operable to provide a user-defined heat-controlled convection to the semiconductor device under test (100). A method of testing a semiconductor device using a heating system is also described.