HEAT CONDUCTIVE ELECTRONIC CIRCUIT BOARD, ELECTRONIC APPARATUS USING THE SAME, AND MANUFACTURING METHOD OF THE SAME

摘要

PROBLEM TO BE SOLVED: To provide an electronic circuit board which meets two contradictory demands for insulation properties and heat conductivity using a conductive substrate made of a metal such as aluminum, which is a metal based electronic circuit board.SOLUTION: A heat conductive electronic circuit board 100 comprises: a conductive substrate 110 that serves as a substrate forming an electronic circuit and also serves as a heat conductor diffusing heat generated in an electronic circuit element; a heat conductive insulation film 120 that is formed by applying an insulative and heat conductive coating material to a surface of the conductive substrate 110 and drying the coating material and has insulation properties and heat conductivity; and an electronic circuit pattern 130 and the electronic circuit element 140 which are formed on a surface of the heat conductive insulation film 120. The heat conductive insulation film 120 has excellent insulation properties and heat conductivity and provides sufficient insulation properties to the electronic circuit pattern 130 despite a small film thickness. Further, due to its good heat conductivity and the small film thickness, the heat conductive insulation film 120 does not become a heat resistor and efficiently transmits the heat generated in the electronic circuit element from the electronic circuit pattern 130 to the conductive substrate 110 to radiate the heat to the exterior of the system.