| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a dispersant for photoresist which has no adverse effect on the curing of a photoresist even if mixed with the photoresist, makes a cured photoresist excellent in etching resistance and is low in foamability. <P>SOLUTION: The dispersant for the photoresist is represented by general formula (1), wherein R represents a 8-22C hydrocarbon group optionally having oxygen and/or nitrogen atoms, X represents a 2-4C alkylene group, m represents a number of 2-100, n represents 1 or 2, and Y represents a hydrogen atom, an acryl group, or a methacryl group. In this case, the ratio of the oxyethylene group in (XO)<SB>m</SB>is ≥50 mass%, and Y has at least one acryl group or one methacryl group. <P>COPYRIGHT: (C)2010,JPO&INPIT |
