HEAT-CURABLE POLYORGANOSILOXANE COMPOSITION AND USE THEREOF

摘要

This is to provide a heat-curable polyorganosiloxane composition. The heat-curable polyorganosiloxane composition comprises (A) an alkenyl group-containing linear polyorganosiloxane represented by the formula (I); (B1) a linear polyorganohydrogensiloxane represented by the formula (II); (B2) a cyclic polyorganohydrogensiloxane comprising an R e 2 HSiO 1/2 unit (wherein R e represents a hydrogen atom or C 1 -C 6 alkyl group) and an SiO 4/2 unit, and having three or more hydrogen atoms bonded to a silicon atom in one molecule; (C) a platinum series catalyst; and (D) an adhesion promoter, a ratio of a sum (H B1 +H B2 ) of a number H B1 of the hydrogen atom(s) of (B1) and a number H B2 of the hydrogen atom(s) of (B2) based on a number Vi A of the alkenyl group(s) of (A) is 0.2 to 1.0, and H B1 is 0.5 to 0.8 based on H B1 +H B2 .