Embodiments of the invention provide enclosures for electronic components and methods for manufacturing the same. In one embodiment, the enclosure includes first and second sidewalls formed from a single elongated piece of sheet metal. The first sidewall, the second sidewall, a third sidewall, and a fourth sidewall define an interior space of the enclosure. At least one of the first and second sidewalls includes an edge region folded inwardly relative to the interior space to form a mounting channel. The enclosure further includes a backwall coupled with first edges of the sidewalls and a door hingedly coupled with a second edge of at least one of the sidewalls.
