发明名称 |
Wafer-trilayer adhesive layer-support composite, wafer support with trilayer adhesive layer for use in wafer processing, trilayer adhesive layer for use in wafer processing, method of manufacturing said composite and method of manufacturing a thin wafer using said composite |
摘要 |
A wafer processing laminate is provided comprising a support (3), a temporary adhesive layer (2), and a wafer (1). The temporary adhesive layer (2) has a trilayer structure consisting of a first temporary bond layer (A) of thermoplastic siloxane bond-free polymer, a second temporary bond layer (B) of thermoplastic siloxane polymer, and a third temporary bond layer (C) of thermosetting modified siloxane polymer. In a peripheral region, the second layer (B) is removed so that the first layer (A) is in close contact with the third layer (C). |
申请公布号 |
EP2657963(A2) |
申请公布日期 |
2013.10.30 |
申请号 |
EP20130164812 |
申请日期 |
2013.04.23 |
申请人 |
SHIN-ETSU CHEMICAL CO., LTD. |
发明人 |
KATO, HIDETO;SUGO, MICHIHIRO;TAGAMI, SHOHEI;YASUDA, HIROYUKI |
分类号 |
H01L21/683;C09J7/00;C09J7/02 |
主分类号 |
H01L21/683 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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