PASTE APPLYING APPARATUS, PASTE APPLYING METHOD, AND DIE BONDER

摘要

PURPOSE: A paste coating device, a paste coating method, and a die bonder are provided to reduce a wet spot of a coating pattern by forming a small margin part. CONSTITUTION: A paste coating device is initially set (S100). A substrate is mounted on a substrate absorbing unit (S200). The substrate is provisionally positioned (S300). A pattern writing process of a fluid material is performed (S400). The substrate which is completely coated and written is outputted (S500). It is determined whether all substrates are completely coated or not (S600). [Reference numerals] (AA) Supply power; (BB) No; (CC) Yes; (DD) Stop; (S100) Initial setting; (S200) Substrate mounting; (S300) Substrate preliminary position determination; (S400) Exposure; (S500) Substrate discharge; (S600) End ?