| 摘要 |
PURPOSE: A sputter apparatus is provided to uniformly adjust the gap between a target and a shield in a case where a target is wasted according to a deposition process, thereby depositing, on a substrate, a thin film having a desired property. CONSTITUTION: A sputter apparatus includes a chamber (110), a rotation type cathode (140), a shield (200), a shield gap adjustment unit (300), and a shield form deformation unit (400). The shield gap adjustment unit controls the gap between a target (T) and the shield by being connected to the shield, and includes a lift unit and a driving unit. The shield form deformation unit is connected to the shield, and deforms the shape of the shield by pressuring both radial ends of the shield to be correspond to the shape of the consumed target. |
