| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing device capable of exactly acquiring a polishing state of a wafer on a polishing pad even when there is variation in film thickness in a circumferential direction of the wafer.SOLUTION: A sensor head 40 is installed in a polishing table 10, and rotates with the polishing table 10. A polishing device executes an idling process in which polishing of a wafer W on a polishing pad 12 does not substantially proceed while rotating the polishing table 10 and the wafer W, the sensor head 40 acquires film thickness data in the idling process, and a processing section 18 calculates a polishing index value showing progress of the polishing of a film from the film thickness data. |
