COMPOSITION FOR SILICON WAFER POLISHING LIQUID

摘要

PROBLEM TO BE SOLVED: To provide a composition for a silicon wafer polishing liquid or the like which is excellent in storage stability and can reduce surface roughness (haze) and surface defects (LPDs) of a silicon wafer while securing a polishing rate that guarantees good productivity.SOLUTION: A composition for a silicon wafer polishing agent comprises silica particles (component A), at least one or more nitrogen-containing basic compounds (component B) selected from among amine compounds and ammonium compounds, and a water-soluble polymer compound (component C) that contains 10 wt.% or more of a structural unit I represented by the specified general formula (1) and has a weight average molecular weight in the range from 50000 to 1500000 inclusive.