| 摘要 |
PROBLEM TO BE SOLVED: To provide an imaging module which is capable of achieving high heat dissipation efficiency while securing desired condensing efficiency.SOLUTION: The imaging module includes: a solid-state imaging element chip 20 for photoelectrically converting received light; a wiring board 30 on which the solid-state imaging element chip 20 is mounted; a lens 10a arranged on the light receiving surface side of the solid-state imaging element chip 20; a mirror frame 10 which is held by the wiring board 30 and holds the lens 10a; and a thermally conductive resin 40 connected to at least a side surface of the solid-state imaging element chip 20, the mirror frame 10, and the wiring board 30. |
