SUBSTRATE PROCESSING APPARATUS

摘要

PURPOSE: A substrate processing apparatus chucks a substrate with an electrostatic chuck located in a fabrication-processing space and thereby chucks a substrate without the problems of recharging and wiring. CONSTITUTION: A grip portion (110) grips an edge of a substrate (10) having one side and the other side (12). A transport unit (120) transfers the grip portion to a fabrication-processing space for the substrate. A chucking unit (130) chucks the center of the other side of the substrate and prevents the drooping of the substrate. A driver (140) delivers the power for up-down driving of the chucking unit. A control unit (150) controls the transport unit to transport the grip portion with the chucking unit separated. [Reference numerals] (120) Transport unit; (140) Driver; (150) Control unit; (20) Substrate provision unit