| 摘要 |
PROBLEM TO BE SOLVED: To provide a component built-in substrate in which a shield property of the component built-in substrate is improved for high reliability against noise, and to provide a component built-in substrate in which a shield property is improved to attain layout free and energy saving.SOLUTION: A component built-in substrate includes an inner layer part which incorporates an electronic component and contains one or more circuit pattern layers, and a shield layer which is at GND potential and provided in such a manner as tightly fitted across the entire region of both surfaces of the inner layer part. The component built-in substrate is provided on both surfaces of the inner layer part and is imparted with a high shield effect by the shield layer at the GND potential. Therefore, a built-in component and a substrate circuit are hard to be affected by unwanted interference from external electromagnetic waves. Further, the electromagnetic waves generated from the built-in component are hard to leak to the outside. Since the shield layer on both surfaces is at GND potential, even if contacted to other electronic component or electronic equipment, namely other multilayer printed board, or the like, it is hard to be affected by them, contributing to layout-free design. |
