APPARATUS FOR PICKING UP SEMICONDUCTOR DEVICES

摘要

PURPOSE: An apparatus for picking up semiconductor devices is provided to easily separate a device from a dicing tape by tilting and elevating a pickup head. CONSTITUTION: A clamp (102) holds a wafer ring. A pickup head (112) is arranged in the upper part of a wafer. The lower surface of the pickup head comprises vacuum holes. A pickup driving part (130) elevates one side of the pickup head. The pickup driving part separates a selected semiconductor device from a dicing tape.