发明名称 Electronical contact element production method for probe card
摘要 A manufacturing method of electric contact element for the probe card is provided to remove the sacrificial layer without distending the sacrificial layer by using the sacrificial layer for forming the pillar section of the contact element. A manufacturing method of electric contact element for the probe card includes the step for forming the sacrificial layer by coating the insulating material on the substrate(100); the step for forming the photoresist layer on the sacrificial layer; the step for removing selectively by etching the site corresponding to the photoresist layer with the wire portion(110) of substrate; the step for forming the molding for the pillar section of the contact element by removing selectively the site on the sacrificial layer corresponding to the wire portion.
申请公布号 KR101322264(B1) 申请公布日期 2013.10.25
申请号 KR20070049787 申请日期 2007.05.22
申请人 发明人
分类号 H01L21/66 主分类号 H01L21/66
代理机构 代理人
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