| 摘要 |
PROBLEM TO BE SOLVED: To avoid pattern failure by preventing occurrence of a water-repellent resist residue due to rinse failure; and improve yield.SOLUTION: A semiconductor device manufacturing method comprises a process of performing a rinse treatment on a substrate by supplying a rinse liquid including water containing a surfactant from the center to an end of the substrate while rotating the substrate which includes a water-repellent resist. A rinse apparatus comprises: rotation means capable of rotating a wafer chuck; a rinse liquid discharge nozzle; supply means capable of supplying the rinse liquid including the water containing the surfactant to the rinse liquid discharge nozzle; and transfer means capable of transferring the rinse liquid discharge nozzle from above the center of the substrate toward above the end of the substrate. |
