| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for producing a polyimide laminate having reduced warpage, and excellent in adhesion between a substrate and a polyimide resin film.SOLUTION: A method for producing a polyimide resin film on a substrate includes the following processes of a-c, and a method for producing a polyimide laminate using the polyimide resin film is provided. The method for producing a polyimide resin film on a substrate includes: a process (a) of forming a polyimide precursor resin film on a substrate by coating the substrate or a polyimide precursor resin film having been formed on the substrate with a polyimide precursor resin film-forming liquid containing at least a polyimide precursor resin and a solvent A, and drying the obtained coated film to a residual amount of the solvent A of 1-45 wt.%; a process (b) of immersing the polyimide precursor resin film obtained by the process (a) in the solvent A and a solvent B having compatibility to the solvent A; and a process (c) of closing the ring of the polyimide precursor resin in the polyimide precursor resin film after the process (b), by performing a first heat treatment of heating the polyimide precursor resin film at a temperature of 130-250°C, a cooling treatment of cooling at a temperature of 0-120°C, and a second heat treatment of heating at a temperature of 250-450°C in this order. |
