| 摘要 |
PROBLEM TO BE SOLVED: To provide a sensor module having a structure by which a sensor module formed by installing a sensor element on a board with high positional accuracy can be manufactured with high productivity.SOLUTION: The sensor module includes: a wiring board 8 having multiple protrusions 20 on an internal surface of a first element positioning hole 8c; and a first sensor element 5 which is installed at the first element positioning hole 8c and detects stress. The multiple protrusions 20 being in contact with the first sensor element 5 support the first sensor element 5, and each of the protrusions has a pair of support ends 29 being in contact with the first sensor element 5 in a cross-sectional view of the wiring board 8. A side face where the first sensor element 5 is in contact with the wiring board 8 is parallel to a line segment connecting the pair of the support ends 29. |
