发明名称 IMAGE PICKUP MODULE
摘要 PROBLEM TO BE SOLVED: To provide an image pickup module 10 high in reliability of a joint between an image pickup chip 20 and a wiring board 30.SOLUTION: An image pickup module 10 comprises: an image pickup chip 20 with a light receiving part 21 of an image pickup element and a plurality of electrodes 22 connected to the light receiving part 21 formed on a main surface; and a wiring board 30 that has a flying lead 31 joined to each of the plurality of electrodes 22.
申请公布号 JP2013219468(A) 申请公布日期 2013.10.24
申请号 JP20120086723 申请日期 2012.04.05
申请人 OLYMPUS CORP 发明人 YAMADA MASAFUMI
分类号 H04N5/335;H01L27/14 主分类号 H04N5/335
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