PERMANENTLY BONDED FLUID CHANNEL NOZZLE PLATE FABRICATION

摘要

Fabricating a printhead includes providing a silicon wafer including first and second surfaces and a nozzle membrane layer on the first surface of the silicon wafer. The silicon wafer is sized to a thickness ranging from 10 to 250 microns. A plurality of chambers is defined on the second surface of the silicon wafer by depositing and patterning a mask on the second surface of the silicon wafer. The plurality of chambers is formed in the silicon wafer by etching portions of the silicon wafer that are exposed by the mask. A second wafer, permanently bonded to the second surface of the silicon wafer, includes a material property that is compatible with a material property of the silicon wafer. A preformed fluid channel of the second wafer is in fluid communication with the plurality of chambers of the silicon wafer after permanent bonding of the wafers.