发明名称 FLEXIBLE PRINTED WIRING BOARD AND MANUFACTURING METHOD OF THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a flexible printed wiring board which reduces the manufacturing processes of a double sided flexible printed wiring board, enables secure connection between circuit patterns provided on both side surfaces of an insulation base material, and effectively utilizes a blind via hole formation region.SOLUTION: In a flexible printed wiring board 100, circuit patterns 5, 6 are formed on both side surfaces of an insulation base material 2. The flexible printed wiring board 100 includes: blind via holes 7, each of which reaches from a surface of the one circuit pattern 5 to a bottom surface of the other circuit pattern 6; and a terminal surface plating layer 12 that is formed on the surface of the one circuit pattern where the blind via holes are formed and connects the one circuit pattern with the other circuit pattern through the via holes.
申请公布号 JP2013219144(A) 申请公布日期 2013.10.24
申请号 JP20120087620 申请日期 2012.04.06
申请人 SUMITOMO ELECTRIC PRINTED CIRCUIT INC 发明人 HAMADA KENJI
分类号 H05K1/11;H05K3/42 主分类号 H05K1/11
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