发明名称 ADHESIVE COMPOSITION, ADHESIVE FILM AND METHOD FOR TREATING SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide an adhesive composition which has flexibility and is excellent in adhesion to a substrate interface, an adhesive film, and a method for treating a substrate, using the adhesive composition.SOLUTION: An adhesive composition includes: a hydrocarbon resin; an elastomer in which the ratio of a monomer unit having a double bond in its main chain to all monomer units is 1 mol% or less; and a solvent. Relative to 100 pts.wt. of the hydrocarbon resin, the elastomer is included in the range of &ge;1 pt.wt. and <20 pts.wt.
申请公布号 JP2013216857(A) 申请公布日期 2013.10.24
申请号 JP20120283704 申请日期 2012.12.26
申请人 TOKYO OHKA KOGYO CO LTD 发明人 IMAI HIROFUMI;TAMURA KOKI;KUBO ATSUSHI;YOSHIOKA TAKAHIRO
分类号 C09J201/00;C09J5/06;C09J7/02;C09J11/06;C09J145/00;C09J153/02;H05K1/03;H05K3/38 主分类号 C09J201/00
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