| 摘要 |
PROBLEM TO BE SOLVED: To provide a power module which achieves long life of a power device chip and high design flexibility at low costs.SOLUTION: In a power module according to this invention, a power device chip 5 is disposed in an enclosure case 1, and an electrode of the power device chip 5 is connected to an external electrode integrated with the enclosure case 1. The power module comprises: a heat spreader 3 fixed to the interior of the enclosure case 1; the power device chip 5 joined onto the heat spreader 3 by soldering; an insulation dam 4 that is formed on the heat spreader 3 enclosing the power device chip 5; and an internal main electrode 7 where one end is joined to the electrode of the power device chip 5 by the soldering and the other end is fixed onto an upper surface of the dam 4. The external electrode 10a and the other end of the internal main electrode 7 are electrically connected by wire bonding. |
