发明名称 |
Method for producing a micromechanical component having a trench structure for backside contact |
摘要 |
A method for manufacturing a micromechanical component is proposed. In this context, at least one trench structure having a depth less than the substrate thickness is to be produced in a substrate. In addition, an insulating layer and a filler layer are produced or applied on a first side of the substrate. The filler layer comprises a filler material that substantially fills up the trench structure. A planar first side of the substrate is produced by way of a subsequent planarization within a plane of the filler layer or of the insulating layer or of the substrate. A further planarization of the second side of the substrate is then accomplished. A micromechanical component that is manufactured in accordance with the method is also described.
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申请公布号 |
US8564078(B2) |
申请公布日期 |
2013.10.22 |
申请号 |
US201113291350 |
申请日期 |
2011.11.08 |
申请人 |
SCHEUERER ROLAND;WEBER HERIBERT;GRAF ECKHARD;ROBERT BOSCH GMBH |
发明人 |
SCHEUERER ROLAND;WEBER HERIBERT;GRAF ECKHARD |
分类号 |
H01L29/84 |
主分类号 |
H01L29/84 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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