发明名称 System having improved surface planarity for bit material deposition
摘要 The present invention provides a method of fabricating a portion of a memory cell, the method comprising providing a first conductor in a trench which is provided in an insulating layer and flattening an upper surface of the insulating layer and the first conductor, forming a material layer over the flattened upper surface of the insulating layer and the first conductor and flattening an upper portion of the material layer while leaving intact a lower portion of the material layer over the insulating layer and the first conductor.
申请公布号 US8565016(B2) 申请公布日期 2013.10.22
申请号 US20080153073 申请日期 2008.05.13
申请人 YATES DONALD L.;DREWES JOEL A.;MICRON TECHNOLOGY, INC. 发明人 YATES DONALD L.;DREWES JOEL A.
分类号 G11C11/14;H01L21/3205;G11C11/00;G11C11/15;H01L21/768;H01L21/8246;H01L27/105;H01L27/22;H01L43/08 主分类号 G11C11/14
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