| 摘要 |
<p>Upper-surface electrodes (1211, 1221) are formed on one principal surface, of an insulating substrate (120) of an interposer (12), on which a multilayer ceramic capacitor (11) is installed. The insulating substrate (120) is formed to substantially the same shape as the installed multilayer ceramic capacitor (11) when viewed from the direction orthogonal to the principal surface, and the multilayer ceramic capacitor (11) is installed so that the length directions substantially match. Cutout sections (Cd11, Cd12, Cd13, Cd14) provided with connecting electrodes (401-404) are formed on four corners of the insulating substrate (120) when viewed from the direction orthogonal to the principal surface. The connecting electrodes (401-404) connect the upper-surface electrodes (1211, 1221) on one principal surface to respective lower surface electrodes (1212, 1222) formed on the other principal surface, the lower surface electrodes connecting to a circuit board (20).</p> |
