| 摘要 |
FIELD: chemistry.SUBSTANCE: invention relates to polymer chemistry, particularly to adhesive compositions based on epoxy resins for weld-bonded joints, used in various industries, primarily in aircraft engineering, for gluing and corrosion protection of panels on perimetre hemming, as well as for sealing various articles. The adhesive composition has components in the following ratio (pts.wt): epoxy-diane resin - 100, thermoplastic modifier - polysulphone - 5-20, aluminosilicate clay - 0.5-1.0, curing agent - dicyandiamide - 8-20.EFFECT: invention provides high strength, frost-resistance of the adhesive joint and longer working life of the adhesive.2 tbl, 1 ex |
