| 发明名称 |
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE |
| 摘要 |
<p>PURPOSE: A method for manufacturing a semiconductor device is provided to prevent bubbles by heating a holding tape over 0.6 times higher than the melting temperature of the holding tape. CONSTITUTION: A wafer is located on an alignment part (2). The wafer is transferred to a wafer mounting unit (3). A dicing frame (5) is located on the alignment part. The dicing frame is transferred to the wafer mounting unit. The dicing frame is received in a wafer receiving unit (6).</p> |
| 申请公布号 |
KR20130114610(A) |
申请公布日期 |
2013.10.18 |
| 申请号 |
KR20130030099 |
申请日期 |
2013.03.21 |
| 申请人 |
MITSUBISHI ELECTRIC CORPORATION |
发明人 |
NAKATA KAZUNARI;TERASAKI YOSHIAKI |
| 分类号 |
H01L21/301;H01L21/78 |
主分类号 |
H01L21/301 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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