发明名称 THIN PLATE LAMINATE FOR RESISTANCE WELDING AND METHOD FOR MANUFACTURING THEREOF
摘要 PURPOSE: Thin plate lamination for resistance welding and a manufacturing method thereof are provided to resistance-weld a plurality of thing plates of different metal materials by laminating the thin plates in multiple layers and to resistance-weld thin plates of a same material. CONSTITUTION: Thin plate lamination for resistance welding includes a plurality of thin plates (10a, 10b, 10c) laminated on each other and embossing units (21a, 21b, 21c). The embossing are formed on the thin plates respectively or formed on the thin plate except for the lowest layer and forms a joint unit joining the thin plates each other. The size of the embossing units is increased according to the number of the laminated thin plates. The thin plates are laminated to increase the size of the embossing units, pressure and a current are applied to the laminated plates so that the embossing units form a nugget and bond the thin plates by being fused.
申请公布号 KR20130114307(A) 申请公布日期 2013.10.18
申请号 KR20120036525 申请日期 2012.04.09
申请人 PUKYONG NATIONAL UNIVERSITY INDUSTRY-UNIVERSITY COOPERATION FOUNDATION;TAESUNG ELECTRONICS CO., LTD. 发明人 CHO, SANG MYUNGM;BYUN, JAE GYU
分类号 B23K11/00;B23K101/00;B32B15/01 主分类号 B23K11/00
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