LIGHT EMITTING DIODE PACKAGE

摘要

PURPOSE: A light emitting diode package is provided to simplify manufacturing processes by bonding an electrode onto a metal substrate. CONSTITUTION: At least one LED chip (50) is mounted on a metal substrate (100). At least one electrode (200, 300) is bonded onto the metal substrate. A molding part is encapsulated on the metal substrate. The molding unit encapsulates an LED chip. The height of a conductive resin layer is same as the height of the molding part.