| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive sheet which can reduce pasting failure to a semiconductor wafer by effectively suppressing generation of voids between an adhesive layer and a self-adhesive film.SOLUTION: An adhesive sheet, wound in a roll form, includes: a long release film; an adhesive layer provided on the release film in a label shape; a self-adhesive film provided so as to cover the adhesive layer, having a label part disposed to come into contact with the release film at the periphery of the adhesive layer, and a surrounding part so as to surround the outside of the label part, where through-holes penetrating the self-adhesive film are provided outside a portion corresponding to the adherend-foreseen portion and inside of the label part. The following relation is satisfied with respect to one label part of the self-adhesive film: (outer peripheral length of the adhesive layer)×1/43≤(maximum width)×(the number of through-hole)≤(outer peripheral length of the adhesive layer). |
