| 摘要 |
PROBLEM TO BE SOLVED: To provide a mask sheet capable of taping on a L/F (lead frame) at a lower temperature than a thermoplastic mask sheet, hardly causing such thermal deterioration that an adhesive deposit is generated at the separation of the mask sheet even after being exposed to a high temperature, having flatness with few warps, harder and more excellent in W/B (wire bonding) characteristics at a high temperature than conventional mask sheets, causing less leak of a molding resin at sealing than an adhesive mask sheet, and providing lightly peelable properties hardly causing adhesive deposits even after a plasma cleaning process.SOLUTION: A mask sheet for producing a semiconductor device is obtained by laminating a thermosetting type adhesive layer on one surface of a base material layer, and is to be pasted to a metal plate peelably, in which the thermosetting type adhesive layer contains a polyimide resin containing a siloxane skeleton, a polyfunctional epoxy resin, a both-terminal epoxy resin, a curing agent and a fluorine-based additive. |
