POWER MODULE SUBSTRATE WITH HEAT SINK, POWER MODULE SUBSTRATE WITH COOLER, AND POWER MODULE

摘要

PROBLEM TO BE SOLVED: To provide a power module substrate with a heat sink capable of restraining a generation and a progress of cracks in a solder layer interposed between a metal layer consisting of Al and the heat sink consisting of Cu, and having the excellent junction reliability.SOLUTION: A power module substrate 20 with a heat sink comprises: a power module substrate 10 in which a circuit layer 12 is arranged on a surface of a ceramic substrate 11 and a metal layer 13 consisting of Al is arranged on an other surface of the ceramic substrate 11; and the heat sink 18 bonded to the other surface side of the metal layer 13 via a solder layer 17 and consisting of Cu or Cu alloy. The metal layer 13 is formed by bonding an Al plate with the Al content of 99.0 mass% to 99.85 mass% to the ceramic substrate 11, and the solder layer 17 is formed of a solid-solution curing type solder material containing Sn as a main component and a solid-solution element solid-dissolved in a Sn mother phase.