发明名称 PROCESS FOR ELECTROLESS DEPOSITION OF METALS USING HIGHLY ALKALINE PLATING BATH.
摘要 <p>A plating process using an electroless plating bath formed from two separate prepared component solutions. The component solutions mixed within 120 hours prior to plating operations, to provide a highly alkaline plating bath solution. One component solution of the two-part plating bath, is provided with a metal salt or source of plating ions, and which is initially kept in a separate solution from the second other prepared component solution. The second component solution contains formaldehyde, and preferably paraformaldehyde, used to reduce the metal salts into the metal to be deposited on a substrate. Each component solution further includes sodium hydroxide in concentrations selected so that when the two solutions are preferably mixed the final plating bath solution has a pH greater than 11.5.</p>
申请公布号 MX2013003935(A) 申请公布日期 2013.10.17
申请号 MX20130003935 申请日期 2011.10.12
申请人 UNIVERSITY OF WINDSOR 发明人 MORDECHAY SCHLESINGER;ROBERT ANDREW PETRO
分类号 C23C18/38;C23C18/24;C23C18/32 主分类号 C23C18/38
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