| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component mounting line which can reduce facility costs, improve area productivity, and reduce production costs.SOLUTION: An electronic component mounting system has: a print inspection unit (print inspection device M2A) for inspecting a solder print state of a substrate in which solder is printed by a solder print unit (printer M1); a mounting inspection unit (mounting inspection device M5A) for inspecting a component mounting state in the substrate where an electronic component is mounted by component mounting units (electronic component mounting devices M2B to M5B); and a substrate delivery device M6 as a single substrate repair work unit for performing repair work for both of a substrate which is provided in a downstream side of the component mounting unit and determined as a defective print state by the print inspection unit and a substrate which is determined as a defective mounting state by the mounting inspection unit, as a target. |
