| 摘要 |
The invention addresses the problem of providing a multilayer wiring board, a manufacturing method therefor and a probe card, said multilayer wiring board making characteristic impedance adjustment easy and enabling use of a narrower pitch. In the multilayer wiring board, in which multiple wiring layers on a substrate are layered with insulation layers therebetween, wires formed in the wiring layers are two-layer-structure wires comprising a first layer and a second layer. The first layer is composed of a first electrically conductive material, and the second layer is composed of a second electrically conductive material that has a larger relative magnetic permeability than the first electrically conductive material. Instead of using wires composed of the first electrically conductive material only, said wires being of identical thickness to the wires of the two-layer structure, the problem is solved by using the two-layer structure to provide the multilayer wiring board, the manufacturing method therefor and the probe card, wherein the characteristic impedance of the wires is adjusted to a value near 50 ohms. |
