发明名称 |
Chemical mechanical polishing slurry, its preparation method and use for the same |
摘要 |
A chemical mechanical polishing slurry for polishing a copper layer without excessively or destructively polishing a barrier layer beneath the copper layer is disclosed and includes an acid, a surfactant, and a silica sol having silica polishing particles that are surface modified with a surface charge modifier and that have potassium ions attached thereto. A method for preparing the chemical mechanical polishing slurry and a chemical mechanical polishing method using the chemical mechanical polishing slurry are also disclosed.
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申请公布号 |
US8557006(B2) |
申请公布日期 |
2013.10.15 |
申请号 |
US201213456413 |
申请日期 |
2012.04.26 |
申请人 |
HOU HUI-FANG;LIU WEN-CHENG;CHEN YEN-LIANG;CHEN JUI-CHING;EPOCH MATERIAL CO., LTD. |
发明人 |
HOU HUI-FANG;LIU WEN-CHENG;CHEN YEN-LIANG;CHEN JUI-CHING |
分类号 |
C09G1/02 |
主分类号 |
C09G1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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