发明名称 Method of inspecting pattern and inspecting instrument
摘要 An electron beam apparatus equipped with a review function of a semiconductor wafer includes a scanning electron microscope to obtain image information of a semiconductor wafer, and an information processing apparatus to process the image information. The information processing apparatus includes a data input unit to receive positional information of a defect on the wafer, a storage for storing a plurality of image information of a position on the wafer corresponding to the positional information, and an image processing unit that retrieves any of the plurality of image information, and classifies the retrieved image information corresponding to the positional information depending on the type of defect.
申请公布号 US8558173(B2) 申请公布日期 2013.10.15
申请号 US20060518893 申请日期 2006.09.12
申请人 NOZOE MARI;NISHIYAMA HIDETOSHI;HIJIKATA SHIGEAKI;WATANABE KENJI;ABE KOJI;HITACHI, LTD.;HITACHI TOKYO ELECTRONICS CO., LTD. 发明人 NOZOE MARI;NISHIYAMA HIDETOSHI;HIJIKATA SHIGEAKI;WATANABE KENJI;ABE KOJI
分类号 G01N23/00;G01Q30/02;G01N21/956;G01N23/20;G01N23/225;G01Q30/04;G01Q30/20;G01R1/06;G01R31/302;H01L21/027;H01L21/66 主分类号 G01N23/00
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