| 摘要 |
PURPOSE: A method for manufacturing an LED module with a DPM using a heat radiation base made of insulating materials and an LED lamp using the same are provided to save energy by directly printing an electric circuit pattern on the heat radiation base made of the insulating materials. CONSTITUTION: An electric circuit pattern is printed on the upper surface of a heat radiation base made of insulating materials (S21). The upper surface of the printed circuit pattern is printed with PSR ink (S22). A soldering part is printed with cream solder (S23). An LED chip is automatically mounted on the part printed with the cream solder (S24). The LED chip is soldered by applying heat to the cream solder (S25). [Reference numerals] (AA) Start; (BB) End; (S21) Electric circuit pattern is printed using a conductive ink on the upper surface of a heat radiation base made of insulating materials; (S22) Upper surface of the printed circuit pattern is printed with PSR ink; (S23) Soldering part of the upper surface of the printed circuit is printed with cream solder; (S24) LED chip is automatically mounted on the part printed with the cream solder; (S25) LED chip is soldered by applying heat to the cream solder |
