发明名称 SILICON EPITAXIAL WAFER AND METHOD FOR PRODUCING SAME
摘要 The present invention includes a method for manufacturing a silicon epitaxial wafer having a silicon homoepitaxial layer formed on a surface of a silicon single crystal wafer, including the steps of: preparing the silicon single crystal wafer such that a plane orientation of the silicon single crystal wafer is tilted at an angle in the range from 0.1° to 8° in a <112> direction from a {110} plane; and growing the silicon homoepitaxial layer on the prepared silicon single crystal wafer. According to the present invention, a silicon epitaxial wafer using the {110} substrate with improved surface quality, such as Haze and surface roughness and a method for manufacturing the silicon epitaxial wafer are provided.
申请公布号 KR20130113308(A) 申请公布日期 2013.10.15
申请号 KR20127030143 申请日期 2011.04.28
申请人 SHIN-ETSU HANDOTAI CO., LTD. 发明人 SHIGA YUTAKA;TAKENO HIROSHI
分类号 H01L21/20;H01L29/04 主分类号 H01L21/20
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