发明名称 CURABLE COMPOSITION, CURED PRODUCT AND PHOTO-SEMICONDUCTOR DEVICE
摘要 PURPOSE: A curable composition has high resistance against thermal impact, high temperature, and high humidity, and forms a cured material capable of preventing cracks under a severe environment. CONSTITUTION: A curable composition contains a compound represented by chemical formula 1, polysiloxane represented by chemical formula 2, and a hydrosilylation reaction catalyst. In chemical formula 1, n is an integer from 1 or greater; each of R^1 and R^2 is C1-4 alkyl group; Ar is an aryl group; each of R^3, R5, and R^6 is an organic group; R6 is a C1-4 alkyl group or an aryl group; at least one of R^4 is a C1-4 alkyl group or an aryl group; at least one of R^4 is an aryl group; X is hydrogen or C1-3 alkyl group; a, c, e, and f are an integer from 0 or greater; and b and d are an integer from 1 or greater.
申请公布号 KR20130112761(A) 申请公布日期 2013.10.14
申请号 KR20130035075 申请日期 2013.04.01
申请人 JSR CORPORATION 发明人 GOTOU YUUTA;NAKANISHI KOUJI;NEMOTO TETSUYA;NOMURA HIROYUKI;HASEGAWA KOUICHI;TAMAKI KENTAROU
分类号 C08G77/04;C08K5/5415;C08L83/04;H01L23/29 主分类号 C08G77/04
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