| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive composition which lowers adhesive force by heating, electromagnetic wave irradiation, or the like, to provide a filmy adhesive using the same, and to provide a method for peeling an adherend therewith.SOLUTION: There are provided an adhesive composition comprising an adhesive, and low melting point glass dispersed in the adhesive; and a filmy adhesive containing the adhesive composition. |
