发明名称 LED Cooling Structure
摘要 LED COOLING STRUCTURE A LED cooling structure includes a substrate (10) having a circuit 5 layout (11) and one or a number of thermally conductive plates (14) arranged on the top wall thereof, one or a plurality of through holes (12) cut through the opposing top and bottom walls thereof and a thermally conductive post (13) mounted in each through hole (12) and connected with the thermally conductive plates (14), and one or a number of light-emitting devices (20) 10 mounted at the substrate (10) and electrically connected to the circuit layout (11) with the bottom side thereof kept in contact with one respective thermally conductive plate (14) for quick dissipation of heat.
申请公布号 AU2012244393(B1) 申请公布日期 2013.10.10
申请号 AU20120244393 申请日期 2012.11.07
申请人 YEH, CHAO-CHIN 发明人 YEH, CHAO-CHIN
分类号 F21V29/00 主分类号 F21V29/00
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