发明名称 LASER PROCESSING METHOD AND LASER PROCESSING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a laser processing method which can efficiently remove slag generated on a work surface in the vicinity of a piercing hole when radiating a laser beam to a stainless steel workpiece to form the piercing hole therein, and to provide a laser processing apparatus.SOLUTION: A laser processing apparatus 1 includes: a laser nozzle 10; an assist gas feeding unit 30; a servo control unit 40; and a control unit 50. The control unit 50 is configured to execute: a first step of forming a piercing hole H in a workpiece W; a second step of enlarging the piercing hole H; a third step of enlarging the hole H formed in the second step; and a fourth step of moving the laser nozzle 10 on an outer peripheral side from the hole H formed in the third step and injecting a removing gas from the laser nozzle 10 to remove slag, in this order.
申请公布号 JP2013208631(A) 申请公布日期 2013.10.10
申请号 JP20120079246 申请日期 2012.03.30
申请人 NISSAN TANAKA CORP 发明人 NUMATA SHINJI;KAMIKIHARA HIROTAKA
分类号 B23K26/38;B23K26/14 主分类号 B23K26/38
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