| 摘要 |
PROBLEM TO BE SOLVED: To provide a print circuit board allowing formation of a conductor land with a small diameter, and provide a manufacturing method of the print circuit board.SOLUTION: A first conductor land 36a on a first face F of a core substrate is formed by forming a first opening 35a in a plated resist film 35 by means of a laser having high location accuracy and plating the inside of the opening. Therefore, even if the first conductor land 36 is formed in a small diameter, resulting in a not-aligned formation relative to a through-hole hole 31 by the maximum of a precision error, the first conductor land is formed with a through-hole opening 31 covered. |
