RESIN COMPOSITION, POLYMER, CURED FILM, AND ELECTRONIC PARTS

摘要

PROBLEM TO BE SOLVED: To provide: a resin composition capable of forming a cured film excellent in elongation property; a polymer suitable as a constituting component of the composition; a cured film formed from the composition; and electronic parts having the cured film.SOLUTION: A resin composition contains: (A) a polymer having a structural unit represented by formula (a1) and having a hydroxyl group, and a structural unit represented by formula (a2) and having a cationically polymerizable group; and (F) a solvent.